Wafer Aligner

Feature

Most compact design in industry, support various materials and notch detection functions. Wafer aligning, wafer centering and angle corrections can be finished within 4.9 seconds.

Accuracy of Centering

±0.1

Positioning accuracy (θ)

±0.2°

Wafer aligningtime

<5.9

APPLICATION

Semiconductor Industry

HIWIN Technical Support

Full Specs

Select HIWIN near you

Taiwan, China

Tel:+886-4-2359-4510

Ext 1202, 1235

Suzhou, Mainland China

Tel:+86-512-80685599

Ext 7511, 7460

Fax: +86-512-80689858

Japan Korea

Tel:+886-4-2359-4510

Ext 1278, 1255

Other

Tel:+886-4-2359-4510

Ext 8412

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