features●HPAseriesisathree-axiscontrolledwaferedgefinder.ThewholeseriesadoptsHIWINmicrosingleaxisrobotmoduletorealizetheadvantagesofhighspeed,highprecision,highrigidity,highefficiencyandsmallvolume.●allinonedesign,withoutadditionalcontrollerandwiringspace,theproductvolumeisthesmallestintheindustryundertheconditionofequalspecifications.●equippedwithintelligentlighttransparentlasersensor,itcansupportthecontourdetectionfunctionoftransparent,translucentandopaqueobjects,andisapplicabletothewaferandglasswithadiameterof100mm~300mm.●thecleanlinessgradeoftheproductisISOclass3(Class1),andtheapplicationrangeincludessemiconductor,optoelectronicsandotherindustries.applicationItisapplicabletothecalibrationandalignmentofsemiconductorindustry(wafer),LEDindustry(sapphiresubstrate),photoelectricindustry(glass),etc.

FeaturesHIWINoffersavarietyofpositioningplatforms,suchassingle-axis,X-Ydual-axle,bridge,gantryandX-Y-Zthree-axisorthogonalrobotstomeettheneedsofavarietyofautomationapplications.Avarietyofpositioningplatformshavebeenwidelyusedinvarioustechnicalfields,suchasopticalinspection,laserprocessing,rubbercoating,metalprocessingandotherautomatedproductionequipment.Withrichspecificationsandfastcustomization,itcanfullymeetthehigh-levelrequirementsofmassproduction,shortenedproductdevelopmenttimeandstrictuseenvironment.