● HPA series is a three-axis controlled wafer edge finder. The whole series adopts HIWIN micro single axis robot module to realize the advantages of high speed, high precision, high rigidity, high efficiency and small volume.
● all in one design, without additional controller and wiring space, the product volume is the smallest in the industry under the condition of equal specifications.
● equipped with intelligent light transparent laser sensor, it can support the contour detection function of transparent, translucent and opaque objects, and is applicable to the wafer and glass with a diameter of 100mm~300mm.
● the cleanliness grade of the product is ISO class 3 (Class 1), and the application range includes semiconductor, optoelectronics and other industries.
It is applicable to the calibration and alignment of semiconductor industry (wafer), LED industry (sapphire substrate), photoelectric industry (glass), etc.