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+86-512-80685599

 Page Copyright© HIWIN TECHNOLOGIES(CHINA) CORP.  Copyright 2018 All Rights Reserved.    Powered by www.300.cn  苏ICP备18061715号  

 

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产品名称

RWS Wafer Robot

特征软硬件垂直整合优势,并且采用高精密,高刚性直驱马达,重复精度达±0.02mm,回转半径小,空间使用率高。 应用适用于半导体产业(晶圆取放)、光电产业(小型面板、小型太阳能板)、LED产业(蓝宝石基板、胶环)等取放设备。
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Product parameters

Features

The advantages of vertical integration of hardware and software, and the use of high-precision, high-rigidity direct drive motor, repeatability of ± 0.02mm, small radius of gyration, high space utilization.

 

Application example

Applicable to the semiconductor industry (wafer pick and place), optoelectronic industry (small panel, small solar panels), LED industry (sapphire substrate, rubber ring) and other pick and place equipment.

 

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